China FPC/ Flexible PCB/ Rigid-Flex PCB/ HDI Flex PCB/FPC, PCB/ Flex PCB Laminating Service
Port:
Shenzhen, China
Production Capacity:
10000sqm/Month
Payment Terms:
T/T, Western Union, Paypal
Shenzhen Semshine Tech Co., Ltd.
Guangdong, China
Last Login Date:
May 22, 2021
Business Type:
Manufacturer/Factory, Trading Company
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Product Description
Company Info
Basic Info.
Model NO.
SPCB-414
Structure
Double-Sided FPC
Material
Polyimide
Combination Mode
Without Adhesive Flexible Plate
Application
Computer with LCD Screen
Conductive Adhesive
Conductive Silver Paste
Flame Retardant Properties
V0
Processing Technology
OSP
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Semshine
Trademark
Semshine
Transport Package
Standard Carton Package
Specification
Origin
Guangdong, China
HS Code
853400
Product Description
| Description | PCB Specification |
| Material | FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum/PI |
| Layer | 1-20 |
| Board Thickness | 0.2mm-4.0mm |
| Board Thickness Tolerance | +/-10% |
| Copper Thickness | 17.5um-175um(0.5oz-5oz) |
| Min Trace Width | 0.15mm |
| Min Space Width | 0.15mm |
| Min Drilling Dia | 0.2mm |
| PTH copper thickness | 0.4-2mil(10-50um) |
| Tolerance of Etching | ±1mil(±25um) |
| V-cut angle | 25°,30°,45°,60° |
| Pearl Strength of line | ≥6lb/in(≥107g/mm) |
| Impedance control and tolerance | 50Ω±10% |
| Twist & Wrap | ≤ 0.5% |
| Soldermask | Green, Red, Blue, White, Black, Yellow |
| Surface Finish / Plating | HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gold/ENIG |
| Certificate | ROSH , ISO9001, UL Certificate |
| File | Protel 99se/P-CAD/Autocad/Cam350 |
| Inner packing | Vacuum packing,Plastic bag |
| Outer packing | Standard carton packing |
| Detailed Terms for PCB Assembly | |
| Quantity | Prototype&Low Volume PCB Assembly, from 1 Board to 250, is for specially, but we can handle orders up to 1000. |
| Type of Assembly | SMT and Thur-hole |
| Solder Type | Water Soluble Solder Paste, Leaded and Lead-Free |
| Components | Passives Down to 0201 Size; BGA and VFBGA; Leadless Chip Carries/CSP; Double-Sided SMT Assembly; Fine Pitch to 08 Mils; BGA Repair and Reball; Part Removal and Replacement-Same Day Service. |
| Bare Board Size | Smallest 0.25×0.25 Inches; Largest 20×20 Inches. |
| File Formats | Bill of Materials; Gerber Files; Pick-N-Place File (XYRS). |
| Type of Service | Turn-Key, Partial Turn-Key or Consignment. |
| Component Packaging | Cut Tape; Tube; Reels; Loose Parts. |
| Turn Time | Same Day Service to 15 day service. |
| Testing | Flying Probe Test; XRAY inspection AOI Test. |
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